soldering - is there a standard name for surface-mounted 0.1" pitch DIP packages?

I've seen several boards that have ICs that look very similar to standard through-hole DIP packages (in particular, the packages have pins on 0.1" pitch), but the boards do not have any holes for the pins of those ICs.

Surface-mount components with 0.05" pitch are called "SOIC". What is the standard name (or a popular name) for these components with 0.1" pitch that are intended to be surface-mounted? (E.g., components such as the Fairchild DF04S, Shindengen S1ZB60-7072, CEL PS2501AL-1-F3-A, Toshiba TLP172G, etc.) I expected the datasheets for these components to mention some standard name -- like datasheets for other components mention standard packages such as "TO-92", "DPAK", "TQFP", etc. -- but I don't see one.

Is there a standard name (or a popular name analogous to "dead-bug construction") for the process of attaching standard through-hole DIP components to a board without holes? (The process involves folding their leads one way or the other, gull-wing or J-lead).