My PCB layout package (Altium) has an option to define the full stack of a via so one may have different sized annular rings on different layers.
I was wondering if it is considered "manufacturable" if a via has annular rings only on layers where it connects to other copper. On layers without connection (passthrough), may have no annular ring, just the plated hole. I understand this this is more of a question for a board house, but i was wondering what the general opinion on this is.
The motivation behind this question is that in very high density designs, it may be critical to have less clearance on an internal GND plane for example. The lack of the annular ring would be of great benefit as it would reduce the area the via needs to pass hough the internal GND plane.
Thanks in advance.
Answer
Removing non functional inner pads should lead to a more reliable plated through hole via. Some people might also say it reduces drill wear for your mfg but the primary reason is long term reliability especially under thermal stress.
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