ICs are typically packaged (encapsulated) in a black "plastic". What is this packaging material made of?
(source)
Answer
Transfer-molded epoxy (which is a thermoset material).
Thermoset plastics, once cross-linked will not melt, they only char at high temperatures.
See, for example, this TI/NS document:
As mentioned in the NS document above, epoxy cresol novolac (ECN) is the most common ingredient of these epoxies.
(source)
Link to fire at Sumitomo in Japan in '93.
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