Every development board I have ever used that includes a 32.786Khz crystal has always had its can soldered directly to board.
What is the reason for this ? Is this to minimize radiated energy from the crystal during its operation (assuming that the pad its soldered to is ground) ?
If the can was not soldered to the board, what would be the effect ?
Added
If you look at this image, the crystal has 3 solder points. Two for the legs, and one for the case/shell/can (green arrow).
My question is about the reason for soldering the case/shell/can to the board.
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