Wednesday 19 October 2016

physical design - What are the general steps used in creating a ASIC?


I'm following a discussion board that discusses an ASIC chip they are building, and they are using terms that I'm unfamilliar with. So far I've gathered



  1. Once a logic design is tested on an FPGA it can be ported to an ASIC with relative ease.

  2. The ASIC is created on a Wafer of ~1000 chips

  3. That wafer is chopped up into smaller chips called "dicing"

  4. "bumping"

  5. Packaging: (not sure what this means: "Aligning the substrates to the fiduciary marks")



As you can infer, I'm a little confused and overwhelmed by the process, but I want to get a handle on what is required and what the end to end process looks like.


Where can I find a detailed list of what happens after I test my FPGA logic and am ready to create several thousand ASICs based on that design?




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